Product Introduction:
LOR & PMGI Lift-off Resists, underlayer Resist.
Non-photosensitive.
Single-Layer Thickness: 50 nm – 6 μm.
Models:
LOR1A/ LOR2A/ LOR3A/ LOR5A/ LOR7A/ LOR10A/ LOR20B;
LOR5B/ LOR10B/ LOR20B;
PMGI-SF3/PMGI-SF6/PMGI-SF9/PMGI-SF11.
Application:
The primary resin material of LOR & PMGI Lift-off Resists is Polydimethylglutarimide (PMGI) polymer. Serving as a sacrificial layer, it is highly suitable for various lift-off processes. LOR & PMGI is used in combination with conventional positive and negative tone resists, and its variable underlayer thicknesses and undercut ratios meet a wide range of application requirements, such as metal lift-off and airbridge fabrication.
Features:
● Applicable for lift-off processes with feature sizes ＜ 0.25 μm.
● No adverse effect on the overlying resist.
● Excellent adhesion to Si, NiFe, GaAs, InP, as well as various III-V and II-VI materials.
● Simple development process with no need for additional organic reagent treatment.
● Compatible with g/h/i-Line, DUV, 193 nm and E-beam photoresists.
● Easy to strip.
● Good thermal stability with a Tg ＞ 190 ℃.
