Process Introduction:
Including UV contact/proximity lithography, UV projection stepper lithography, electron beam lithography, etc.;
UV Contact/Proximity Lithography: Resolution ≥ 2 μm, Precision ± 0.5 μm;
UV Projection Stepper Lithography: Resolution ≥ 0.5 μm, Precision ± 0.2 μm;
Lithography processing is available on rigid substrates such as silicon wafers, glass, quartz, sapphire, as well as flexible materials such as PI.
Processable Size: 2–8 inches
