Process Introduction:
Planar Electroplating
1、Substrate Size: Whole-wafer processing available for 2/4/6-inch substrates with thickness ＜ 2 mm. No electroplating for small wafers/substrates;
2、Electroplating Materials: Copper, Gold, Tin, Nickel;
3、Electroplating Thickness: Typically ≤ 20 μm for standard processes; ultra-thick coatings up to hundreds of micrometers achievable for custom processes.
