Special Materials

UV Curable Dicing Tape for mold Package

Model:

Adwill D-841


Application Scope:

Used for bonding and fixing silicon wafers during thinning or dicing processes;

Bond strength can be altered by UV treatment.

  • UV Curable Dicing Tape for mold Package
  • UV Curable Dicing Tape for mold Package
  • UV Curable Dicing Tape for mold Package
  • UV Curable Dicing Tape for mold Package
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